| Customization: | Available |
|---|---|
| Metal Coating: | Copper |
| Mode of Production: | SMT |
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|
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1
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Material
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FR4, (High Tg FR4, General Tg FR4, Middle Tg FR4), Lead-Free Solder Sheet, Halogen Free FR4, Ceramic Filling Material, PI Material, BT Material, PPO, PPE etc.
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2
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Board thickness
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Mass production: 394mil(10mm) Samples: 17.5mm
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3
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Surface finish
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HASL, Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger
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4
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PCB Max panel size
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1150mm × 560mm
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5
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Layer
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Mass production: 2~58 layers / Pilot run: 64 layers, Flexible PCB: 1-12 Layers
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6
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Min hole size
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Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm)
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7
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PCBA QC
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X-Ray, AOI Test, Functional Test
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8
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Special Process
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Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control.
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9
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Our service
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PCB, Turnkey PCBA, PCB Clone, Housing, PCB Assembly, Component sourcing, PCB manufacturing from 1 to 64 layers
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10
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Sanforized
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Buried via, Blind via, Mixed Pressure, Embedded Resistance, Embedded Capacitance, Local Mixed Pressure, Local High Density, Back drill, impedance control.
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11
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SMT Capacity
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700 Million Points/Day
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12
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DIP Capacity
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5 Million Points/Day
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13
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Certificate
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CE/RoHS/ISO9001/ISO14001/ISO13485/TS16949
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