Customization: | Available |
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Metal Coating: | Copper |
Mode of Production: | SMT |
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1 | Material | FR4, (High Tg FR4, General Tg FR4, Middle Tg FR4), Lead-Free Solder Sheet, Halogen Free FR4, Ceramic Filling Material, PI Material, BT Material, PPO, PPE etc. |
2 | Board thickness | Mass production: 394mil(10mm) Samples: 17.5mm |
3 | Surface finish | HASL, Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger |
4 | PCB Max panel size | 1150mm × 560mm |
5 | Layer | Mass production: 2~58 layers / Pilot run: 64 layers, Flexible PCB: 1-12 Layers |
6 | Min hole size | Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm) |
7 | PCBA QC | X-Ray, AOI Test, Functional Test |
8 | Special Process | Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control. |
9 | Our service | PCB, Turnkey PCBA, PCB Clone, Housing, PCB Assembly, Component sourcing, PCB manufacturing from 1 to 64 layers |
10 | Sanforized | Buried via, Blind via, Mixed Pressure, Embedded Resistance, Embedded Capacitance, Local Mixed Pressure, Local High Density, Back drill, impedance control. |
11 | SMT Capacity | 700 Million Points/Day |
12 | DIP Capacity | 5 Million Points/Day |
13 | Certificate | CE/RoHS/ISO9001/ISO14001/ISO13485/TS16949 |