Mustar Prototype Printed Circuit Board Assembly Electronics Assembly Services

• Customization: Available
• Metal Coating: Copper
• Mode of Production: SMT
• Base Material: FR-4
• Certification: RoHS, CCC, ISO
• Customized: Customized
• Condition: New
• Shape: DIP
• Conductive Type: Bipolar Integrated Circuit
• Integration: Gsi
• Technics: Semiconductor IC
• D/C: Standard
• Warranty: 2 Years
• Mounting Type: Standard, SMT, DIP
• Cross Reference: Standard
• Memory Type: Standard
• Transport Package: Carton
• Specification: unlimited
• Trademark: Mustar
• Origin: Shenzhen
• Production Capacity: 506140

Product Description

Welcome to Mu Star (Shenzhen) Industry Co., LTD

Our Advantages

1. Program and functional test and package by Free.
2. High quality: IPC-A-610E standard, E-test, X-ray, AOI test, QC, 100% functional test.
3. Professional service: PCB Layout, PCB/FPC/Aluminium Making, SMT, DIP, Component Sourcing, PCB Assembly, Housing and assembly,
Box Building, OEM Service.
4. Certifications: 94v-0, CE, SGS, FCC, RoHS, ISO9001, ISO14001, ISO13485, TS16949
5. The warranty period for PCBA: 2 years.
6. About Factory: 16 SMT Lines, 4 DIP Lines, 1 X-Ray, 32 AOI, 2 Sample test machines.

Specification

1	Material	FR4, (High Tg FR4, General Tg FR4, Middle Tg FR4), Lead-Free Solder Sheet, Halogen Free FR4, Ceramic Filling Material, PI Material, BT Material, PPO, PPE etc.
2	Board thickness	Mass production: 394mil(10mm) Samples: 17.5mm
3	Surface finish	HASL, Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger
4	PCB Max panel size	1150mm × 560mm
5	Layer	Mass production: 2~58 layers / Pilot run: 64 layers, Flexible PCB: 1-12 Layers
6	Min hole size	Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm)
7	PCBA QC	X-Ray, AOI Test, Functional Test
8	Special Process	Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control.
9	Our service	PCB, Turnkey PCBA, PCB Clone, Housing, PCB Assembly, Component sourcing, PCB manufacturing from 1 to 64 layers
10	Sanforized	Buried via, Blind via, Mixed Pressure, Embedded Resistance, Embedded Capacitance, Local Mixed Pressure, Local High Density, Back drill, impedance control.
11	SMT Capacity	700 Million Points/Day
12	DIP Capacity	5 Million Points/Day
13	Certificate	CE/RoHS/ISO9001/ISO14001/ISO13485/TS16949