High-Quality Electronic Board Assembly OEM Printed Circuit Board with Green Solder Mask PCBA Manufacturer

• Customization: Available
• Type: Combining Rigid Circuit Board
• Dielectric: FR-4
• Model NO.: 1
• Material: Fiberglass Epoxy
• Application: Aerospace
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Aluminum
• Insulation Materials: Organic Resin
• Brand: Mustar
• D/C: Standard
• Condition: New Original
• Warranty: 2 Years
• Mountng Type: SMT ,DIP
• Memory Type: Standard
• Transport Package: Carton
• Specification: oem
• Trademark: Mustar
• Origin: Shen Zhen
• HS Code: 8538900000
• Production Capacity: 1000000PCS/Month

Product Description

Category	Details
Company Name	Mu Star (Shenzhen) Industry Co., LTD
Advantages - Testing & Packaging	Program and functional test and package for free
Advantages - Quality Standard	IPC - A - 610E standard, E - test, X - ray, AOI test, QC, 100% functional test
Advantages - Professional Services	PCB Layout, PCB/FPC/Aluminium Making, SMT, DIP, Component Sourcing, PCB Assembly, Housing and assembly, Box Building, OEM Service
Advantages - Certifications	94v - 0, CE, SGS, FCC, RoHS, ISO9001, ISO14001, ISO13485, TS16949
Advantages - Warranty Period	2 - year warranty for PCBA
Advantages - Factory Configuration	16 SMT Lines, 4 DIP Lines, 1 X - Ray, 32 AOI, 2 Sample test machines
Specifications - Material	FR4, (High Tg FR4, General Tg FR4, Middle Tg FR4), Lead - Free Solder Sheet, Halogen Free FR4, Ceramic Filling Material, PI Material, BT Material, PPO, PPE etc.
Specifications - Board Thickness	Mass production: 394mil(10mm); Samples: 17.5mm
Specifications - Surface Finish	HASL, Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger
Specifications - PCB Max Panel Size	1150mm × 560mm
Specifications - Number of Layers	Mass production: 2 - 58 layers; Pilot run: 64 layers; Flexible PCB: 1 - 12 Layers
Specifications - Min Hole Size	Mechanical drill: 8mil(0.2mm); Laser drill: 3mil(0.075mm)
Specifications - PCBA QC	X - Ray, AOI Test, Functional Test
Specifications - Special Processes	Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control
Specifications - Services	PCB, Turnkey PCBA, PCB Clone, Housing, PCB Assembly, Component sourcing, PCB manufacturing from 1 to 64 layers
Specifications - Special Treatments	Buried via, Blind via, Mixed Pressure, Embedded Resistance, Embedded Capacitance, Local Mixed Pressure, Local High Density, Back drill, impedance control
Specifications - SMT Capacity	700 Million Points/Day
Specifications - DIP Capacity	5 Million Points/Day
Specifications - Certifications	CE/RoHS/ISO9001/ISO14001/ISO13485/TS16949