New Original PCB Manufacturing PCBA in China

• shape: DIP
• Conductive Type: Bipolar Integrated Circuit
• Integration: GSI
• Shipping Cost: Estimated freight per unit.: about shipping cost and estimated delivery time.
• Currency: US$
• Return&refunds: You can apply for a refund up to 30 days after receipt of the products.
• Technics: Semiconductor IC
• Application: Specific Integrated Circuits
• Type: Digital / Analog IC
• D/C: Standard
• Condition: New Original
• Warranty: 2 Years
• Mounting Type: Standard, SMT, DIP
• Cross Reference: Standard
• Memory Type: Standard
• Transport Package: Carton
• Specification: unlimited
• Trademark: Mustar
• Origin: Shenzhen
• Production Capacity: 506140
• Package Size: 0.10cm * 0.10cm * 0.10cm
• Package Gross Weight: 1.000kg

Product Description

Welcome to Mu Star (Shenzhen) Industry Co., LTD

Mustar Electronics Component Shenzhen New Original In Stock Microcontroller Integrated Circuit Microchip IC Parts BOM Service
 

Our Advantages

1. Program and functional test and package by Free.
2. High quality: IPC-A-610E standard, E-test, X-ray, AOI test, QC, 100% functional test.
3. Professional service: PCB Layout, PCB/FPC/Aluminium Making, SMT, DIP, Component Sourcing, PCB Assembly, Housing and assembly,
Box Building, OEM Service.
4. Certifications: 94v-0, CE, SGS, FCC, RoHS, ISO9001, ISO14001, ISO13485, TS16949
5. The warranty period for PCBA: 2 years.
6. About Factory: 16 SMT Lines, 4 DIP Lines, 1 X-Ray, 32 AOI, 2 Sample test machines.

Specification

1	Material	FR4, (High Tg FR4, General Tg FR4, Middle Tg FR4), Lead-Free Solder Sheet, Halogen Free FR4, Ceramic Filling Material, PI Material, BT Material, PPO, PPE etc.
2	Board thickness	Mass production: 394mil(10mm) Samples: 17.5mm
3	Surface finish	HASL, Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger
4	PCB Max panel size	1150mm × 560mm
5	Layer	Mass production: 2~58 layers / Pilot run: 64 layers, Flexible PCB: 1-12 Layers
6	Min hole size	Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm)
7	PCBA QC	X-Ray, AOI Test, Functional Test
8	Special Process	Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control.
9	Our service	PCB, Turnkey PCBA, PCB Clone, Housing, PCB Assembly, Component sourcing, PCB manufacturing from 1 to 64 layers
10	Sanforized	Buried via, Blind via, Mixed Pressure, Embedded Resistance, Embedded Capacitance, Local Mixed Pressure, Local High Density, Back drill, impedance control.
11	SMT Capacity	700 Million Points/Day
12	DIP Capacity	5 Million Points/Day
13	Certificate	CE/RoHS/ISO9001/ISO14001/ISO13485/TS16949