Customization: | Available |
---|---|
Type: | Combining Rigid Circuit Board |
Dielectric: | FR-4 |
Still deciding? Get samples of US$ 1/Piece
Request Sample
|
Suppliers with verified business licenses
Audited by an independent third-party inspection agency
Category | Details |
---|---|
Company Name | Mu Star (Shenzhen) Industry Co., LTD |
Advantages - Testing & Packaging | Program and functional test and package for free |
Advantages - Quality Standard | IPC - A - 610E standard, E - test, X - ray, AOI test, QC, 100% functional test |
Advantages - Professional Services | PCB Layout, PCB/FPC/Aluminium Making, SMT, DIP, Component Sourcing, PCB Assembly, Housing and assembly, Box Building, OEM Service |
Advantages - Certifications | 94v - 0, CE, SGS, FCC, RoHS, ISO9001, ISO14001, ISO13485, TS16949 |
Advantages - Warranty Period | 2 - year warranty for PCBA |
Advantages - Factory Configuration | 16 SMT Lines, 4 DIP Lines, 1 X - Ray, 32 AOI, 2 Sample test machines |
Specifications - Material | FR4, (High Tg FR4, General Tg FR4, Middle Tg FR4), Lead - Free Solder Sheet, Halogen Free FR4, Ceramic Filling Material, PI Material, BT Material, PPO, PPE etc. |
Specifications - Board Thickness | Mass production: 394mil(10mm); Samples: 17.5mm |
Specifications - Surface Finish | HASL, Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger |
Specifications - PCB Max Panel Size | 1150mm × 560mm |
Specifications - Number of Layers | Mass production: 2 - 58 layers; Pilot run: 64 layers; Flexible PCB: 1 - 12 Layers |
Specifications - Min Hole Size | Mechanical drill: 8mil(0.2mm); Laser drill: 3mil(0.075mm) |
Specifications - PCBA QC | X - Ray, AOI Test, Functional Test |
Specifications - Special Processes | Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control |
Specifications - Services | PCB, Turnkey PCBA, PCB Clone, Housing, PCB Assembly, Component sourcing, PCB manufacturing from 1 to 64 layers |
Specifications - Special Treatments | Buried via, Blind via, Mixed Pressure, Embedded Resistance, Embedded Capacitance, Local Mixed Pressure, Local High Density, Back drill, impedance control |
Specifications - SMT Capacity | 700 Million Points/Day |
Specifications - DIP Capacity | 5 Million Points/Day |
Specifications - Certifications | CE/RoHS/ISO9001/ISO14001/ISO13485/TS16949 |